黄智恒

个人基本简介: 

Ph.D. (2005), 拉夫堡大学(Loughborough University, 英国)
B.Eng. (2000), M.Eng. (2002), 哈尔滨工业大学

电话:020-84110530
邮件:hzh29@mail DOT sysu DOT edu DOT cn

主要经历: 

2006.01 ~ 2008.06 在英国拉夫堡大学任职 Post Doctoral Research Associate, 在由英国 EPSRC 资助的微电子器件三维微集成项目 (3DMintegration Grand Challenge Project) 中从事材料微结构模拟及其与多物理场的融合工作, 2007.08 起经拉夫堡大学批准以 unpaid special leave 方式赴德国马普钢铁所 (MPIE, Max Planck Institute for Iron Research) 任职 Project Scientist, 在德国 BMBF 资助的项目中与钢铁公司以及有限元软件公司合作, 研究基于位错密度的新型材料本构及其与现有有限元软件的集成, 2008.06 获聘中山大学“百人计划”副教授职位后辞职回国工作

学科方向: 

电子封装材料、工艺、 与可靠性
集成计算材料科学与工程(材料基因组)

荣誉获奖: 

2014年广东省第二届高校青年教师教学竞赛三等奖(自然科学应用学科类)
中山大学2013年青年教师授课大赛二等奖
入选2012年广州市珠江科技新星

代表论著: 

1. Xiong H, Huang Z*, Conway P. Effects of stress and electromigration on microstructural evolution in microbumps of three-dimensional integrated circuits. IEEE Transactions on Device and Materials Reliability 14(4): 995-1004, 2014 DOI
2. Huang Z*, Xiong H, Wu Z, Conway P, Davies H, Dinsdale A, En Y, and Zeng Q. Microstructure based multiphysics modeling for semiconductor integration and packaging. Chinese Science Bulletin 59(15): 1696-1708, 2014 DOI
中文版见科学通报58(35): 3704-3716, 2013, URL
3. Wu ZY, Huang Z*, Ma YC, Xiong H, Conway P. Effects of microstructure on thermally-induced linear elastic mechanical behavior of copper through-silicon vias. Electronic Materials Letters 10(1): 281-292, 2014 DOI
4. Xiong H, Huang Z*, Conway PP. A method for quantification of microstructure in miniaturized interconnects with size and geometry effects. Journal of Electronic Materials 43(2): 618-629, 2014 DOI
5. Huang Z*, Xiong H, Wu Z, Conway PP, Altmann F. Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration. Materials 6(10): 4707-4736, 2013 DOI
6. Wu ZY, Huang Z*, Xiong H, Conway PP, and Liu, CQ. Linkages between microstructure and mechanical properties of ultrafine interconnects. Journal of Electronic Materials 42(2): 263-271, 2013 DOI
7. Xiong H, Huang Z*, Wu ZY, Conway PP. A generalized computational interface for combined thermodynamic and kinetic modeling. Computer Coupling of Phase Diagrams and Thermochemistry (CALPHAD) 35(3): 391-395, 2011 DOI

学术专著章节

* P. Kumar, I. Dutta, Z. Huang, P. Conway. Chapter 3 Materials and Processing of TSV, in Y Li, D. Goyal (eds.), 3D Microelectronic Packaging, Springer Series in Advanced Microelectronics 57, 2017, pp. 47-69. DOI
* P. Kumar, I. Dutta, Z. Huang*, P. Conway. Chapter 4 Microstructure and Reliability Issues of TSV, in Y Li, D. Goyal (eds.), 3D Microelectronic Packaging, Springer Series in Advanced Microelectronics 57, 2017, pp. 71-99. DOI

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